| Items |
2024 |
2025 |
| layers |
(MP):16层，(Sampling)：32层 |
(MP)：20层 |
| Max. Board THK |
Sampling 4.0mm / MP ：3.2mm |
Sampling 5.0mm / MP：3.2mm |
| Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
| Base copper |
Inner layer |
1/3 ～ 6OZ |
1/3～8 OZ |
| Outer layer |
1/3 ～ 6 OZ |
1/3 ～ 8 OZ |
| Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
| Max. aspect ratio |
10:01 |
12:01 |
| HDI aspect ratio |
0.8:1 |
1:01 |
| Tol |
PTH |
±0.076mm |
±0.05mm |
| NPTH |
±0.05mm |
±0.03mm |
| solder mask opening |
0.05mm |
0.03mm |
| solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
| (other color) 0.1mm |
(other color) 0.08mm |
| Min. core THK. |
0.1mm |
0.08mm |
| Bow&twist |
≤0.5% |
≤0.5% |
| Routing Tol. |
Sampling :±0.075mm /MP：±0.1mm |
Sampling:±0.075mm /MP：±0.075mm |
| Impedance Tol. |
±10% |
±8% |
| Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| (Min. BGA size) |
0.2mm |
0.15mm |
| （pitch）(Min. BGA Pitch) |
0.65mm |
0.5mm |
| (Working panel size) |
600mm*700mm |
600mm*700mm |
| Spec. Tech. |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |
